{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11257785","patent":{"patent_number":"US-11257785","title":"Multi-module integrated interposer and semiconductor device formed therefrom","assignee":null,"inventors":[],"filing_date":"2020-03-13T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor device is disclosed including a multi-module interposer for enabling communication between one or more semiconductor dies within the device and a host device on which the semiconductor device is mounted. The multi-module interposer may be formed at the wafer level, and provides fan-out signal paths to and from the one or more dies in the device. Additionally, the multi-module interposer allows any of a variety of different semiconductor packaging configurations to be formed at the wafer level, including for example wire bonded packages, flip chip packages and through silicon via (TSV) packages."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-module integrated interposer and semiconductor device formed therefrom","description":"A semiconductor device is disclosed including a multi-module interposer for enabling communication between one or more semiconductor dies within the device and a host device on which the semiconductor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11257785","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11257785","citation_suggestion":"Patentable. \"Multi-module integrated interposer and semiconductor device formed therefrom\" (US-11257785). https://patentable.app/patents/US-11257785","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11257785","json":"https://patentable.app/api/llm-context/US-11257785","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:07:26.430Z"}