{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11257964","patent":{"patent_number":"US-11257964","title":"Sensor package structure","assignee":null,"inventors":[],"filing_date":"2020-06-24T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":9,"abstract":"A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, an opaque support (e.g., a ring-shaped solder mask) disposed on the sensor chip, and a light permeable layer disposed on the opaque support. The sensor chip includes a sensing region. The opaque support surrounds the sensing region, and inner lateral sides of the opaque support form a light-scattering loop wall. The light permeable layer, the light-scattering loop wall of the opaque support, and the sensor chip jointly define an enclosed space therein. When light passes through the light permeable layer and impinges onto the light-scattering loop wall at an incident angle, the light-scattering loop wall scatters the light into multiple rays at angles different from the incident angle."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Sensor package structure","description":"A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, an opaque support (e.g., a ring-shaped solder mask) disposed on the sensor chip, a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11257964","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11257964","citation_suggestion":"Patentable. \"Sensor package structure\" (US-11257964). https://patentable.app/patents/US-11257964","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11257964","json":"https://patentable.app/api/llm-context/US-11257964","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T20:33:05.477Z"}