{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11258270","patent":{"patent_number":"US-11258270","title":"Super-fast transient response (STR) AC/DC converter for high power density charging application","assignee":null,"inventors":[],"filing_date":"2019-06-28T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H02J","H01L","H01L","H01L","H01L","H01L","H02M","H02M","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H02J","H02M","H02M"],"num_claims":20,"abstract":"A charger comprises a housing, a first multi-layer printed circuit board (PCB), a second multi-layer PCB, and a third multi-layer PCB. The first PCB comprises at least a portion of a primary side circuit. The second PCB comprises at least a portion of a secondary side circuit. The third PCB is perpendicular to the first PCB and the second PCB. An isolation coupling element is disposed on the third PCB. The isolation coupling element comprises a multi-layer PCB. The first PCB comprises a high voltage (HV) semiconductor package. A surface of a die paddle of the HV semiconductor package is exposed from a molding encapsulation of the HV semiconductor package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Super-fast transient response (STR) AC/DC converter for high power density charging application","description":"A charger comprises a housing, a first multi-layer printed circuit board (PCB), a second multi-layer PCB, and a third multi-layer PCB. The first PCB comprises at least a portion of a primary side circ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11258270","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11258270","citation_suggestion":"Patentable. \"Super-fast transient response (STR) AC/DC converter for high power density charging application\" (US-11258270). https://patentable.app/patents/US-11258270","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11258270","json":"https://patentable.app/api/llm-context/US-11258270","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:34:37.063Z"}