{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264242","patent":{"patent_number":"US-11264242","title":"Method and apparatus for determining expansion compensation in photoetching process, and method for manufacturing device","assignee":null,"inventors":[],"filing_date":"2019-09-25T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A method and an apparatus for determining expansion compensation in a photoetching process, and a method for manufacturing a semiconductor device are provided. A relative vector misalignment value of a first wafer and a second wafer after being bonded is obtained based on a relative position relationship between a first alignment pattern of the first wafer and a second alignment pattern of the second wafer in a boding structure. A relative expansion value of the first wafer and the second wafer is obtained based on the relative vector misalignment value. A developing expansion compensation value in the photoetching process is obtained. The expansion compensation value is used to the photoetching process of a first conductor layer including the first alignment pattern of the first wafer and/or a second conductor layer including the second alignment pattern of the second wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and apparatus for determining expansion compensation in photoetching process, and method for manufacturing device","description":"A method and an apparatus for determining expansion compensation in a photoetching process, and a method for manufacturing a semiconductor device are provided. A relative vector misalignment value of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264242","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264242","citation_suggestion":"Patentable. \"Method and apparatus for determining expansion compensation in photoetching process, and method for manufacturing device\" (US-11264242). https://patentable.app/patents/US-11264242","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264242","json":"https://patentable.app/api/llm-context/US-11264242","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:08:37.404Z"}