{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264296","patent":{"patent_number":"US-11264296","title":"Hermetically sealed package","assignee":null,"inventors":[],"filing_date":"2019-08-01T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer panel such that the device cavity is enclosed by the glass substrate, the interposer panel, and the wafer. The electrical component package further includes a metal seed layer disposed between the interposer panel and the wafer, and a dielectric coating. The dielectric coating hermetically seals the interposer panel to the glass substrate, the interposer panel to the metal seed layer and the wafer, and the interposer panel hermetically seals the metal seed layer to the glass substrate such that the device cavity is hermetically sealed from ambient atmosphere."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Hermetically sealed package","description":"An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264296","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264296","citation_suggestion":"Patentable. \"Hermetically sealed package\" (US-11264296). https://patentable.app/patents/US-11264296","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264296","json":"https://patentable.app/api/llm-context/US-11264296","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T08:52:50.696Z"}