{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264300","patent":{"patent_number":"US-11264300","title":"Package structure with lid and method for forming the same","assignee":null,"inventors":[],"filing_date":"2018-11-07T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure and method for forming the same are provided. The package structure includes a semiconductor die formed over a first side of an interconnect structure, and the semiconductor die has a first height. The package structure also includes a first stacked die package structure formed over the first side of the interconnect structure, and the first stacked die package structure has a second height. The second height is greater than the first height. The package structure includes a lid structure formed over the semiconductor die and the first stacked die package structure. The lid includes a main portion and a protruding portion extending from the main portion, and the protruding portion is directly over the semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure with lid and method for forming the same","description":"A package structure and method for forming the same are provided. The package structure includes a semiconductor die formed over a first side of an interconnect structure, and the semiconductor die ha","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264300","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264300","citation_suggestion":"Patentable. \"Package structure with lid and method for forming the same\" (US-11264300). https://patentable.app/patents/US-11264300","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264300","json":"https://patentable.app/api/llm-context/US-11264300","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:05:05.322Z"}