{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264312","patent":{"patent_number":"US-11264312","title":"Non-insulated power module","assignee":null,"inventors":[],"filing_date":"2020-07-17T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"An object of the present invention is to achieve both securing an insulation distance and securing a chip mounting area in a non-insulated power module. A non-insulated power module includes a plurality of die pads, a plurality of semiconductor chips mounted on upper surfaces of the plurality of die pads, and a package sealing the semiconductor chips, in which lower surfaces of the plurality of die pads are exposed from a lower surface of the package, on the lower surface of the package, first grooves are formed in areas between the plurality of die pads, and the plurality of die pads have a trapezoidal cross-sectional shape in the thickness direction, in which an area of an upper surface is larger than an area of the lower surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Non-insulated power module","description":"An object of the present invention is to achieve both securing an insulation distance and securing a chip mounting area in a non-insulated power module. A non-insulated power module includes a plurali","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264312","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264312","citation_suggestion":"Patentable. \"Non-insulated power module\" (US-11264312). https://patentable.app/patents/US-11264312","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264312","json":"https://patentable.app/api/llm-context/US-11264312","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:44:53.980Z"}