{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264314","patent":{"patent_number":"US-11264314","title":"Interconnection with side connection to substrate","assignee":null,"inventors":[],"filing_date":"2019-09-27T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"An interconnection structure is disclosed. The interconnection structure includes a base substrate, a set of conductive pads disposed on the base substrate and an interconnection layer disposed on the base substrate. The interconnection layer has an edge located next to the set of the conductive pads and includes a set of side connection pads located and disposed at the edge of the interconnection layer. Each side connection pad is arranged with respect to a corresponding one of the conductive pads disposed on the base substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnection with side connection to substrate","description":"An interconnection structure is disclosed. The interconnection structure includes a base substrate, a set of conductive pads disposed on the base substrate and an interconnection layer disposed on the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264314","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264314","citation_suggestion":"Patentable. \"Interconnection with side connection to substrate\" (US-11264314). https://patentable.app/patents/US-11264314","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264314","json":"https://patentable.app/api/llm-context/US-11264314","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:02:47.048Z"}