{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264329","patent":{"patent_number":"US-11264329","title":"Semiconductor device having metal interconnects with different thicknesses","assignee":null,"inventors":[],"filing_date":"2016-04-01T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"An apparatus includes a first metal layer, a second metal layer and a dielectric material. The first metal layer has a first thickness and a second thickness less than the first thickness, and the first metal layer comprises a first interconnect having a first thickness. The dielectric material extends between the first and second metal layers and directly contacts the first and second metal layers. The dielectric material includes a via that extends through the dielectric material. A metal material of the via directly contacts the first interconnect and the second metal layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having metal interconnects with different thicknesses","description":"An apparatus includes a first metal layer, a second metal layer and a dielectric material. The first metal layer has a first thickness and a second thickness less than the first thickness, and the fir","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264329","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264329","citation_suggestion":"Patentable. \"Semiconductor device having metal interconnects with different thicknesses\" (US-11264329). https://patentable.app/patents/US-11264329","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264329","json":"https://patentable.app/api/llm-context/US-11264329","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:46:07.452Z"}