{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264330","patent":{"patent_number":"US-11264330","title":"Chip package with connection portion that passes through an encapsulation portion","assignee":null,"inventors":[],"filing_date":"2018-08-03T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","G06V","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer without using a separate insulating layer formed on the molding layer as in the conventional art."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package with connection portion that passes through an encapsulation portion","description":"Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264330","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264330","citation_suggestion":"Patentable. \"Chip package with connection portion that passes through an encapsulation portion\" (US-11264330). https://patentable.app/patents/US-11264330","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264330","json":"https://patentable.app/api/llm-context/US-11264330","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:17:03.001Z"}