{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264348","patent":{"patent_number":"US-11264348","title":"Semiconductor device having an ultrasonic bonding portion provided between a substrate and a semiconductor chip","assignee":null,"inventors":[],"filing_date":"2020-01-29T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A semiconductor device of embodiments includes a substrate; a semiconductor chip provided above the substrate; a first ultrasonic bonding portion provided between the substrate and the semiconductor chip; a first terminal plate electrically connected to the semiconductor chip via the first ultrasonic bonding portion, the first ultrasonic bonding portion being provided on the substrate, and the first terminal plate having a first surface facing the semiconductor chip; and a first adhesive layer provided on the first surface, and the first adhesive layer containing a first adhesive."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having an ultrasonic bonding portion provided between a substrate and a semiconductor chip","description":"A semiconductor device of embodiments includes a substrate; a semiconductor chip provided above the substrate; a first ultrasonic bonding portion provided between the substrate and the semiconductor c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264348","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264348","citation_suggestion":"Patentable. \"Semiconductor device having an ultrasonic bonding portion provided between a substrate and a semiconductor chip\" (US-11264348). https://patentable.app/patents/US-11264348","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264348","json":"https://patentable.app/api/llm-context/US-11264348","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:12:24.548Z"}