{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11264366","patent":{"patent_number":"US-11264366","title":"Module","assignee":null,"inventors":[],"filing_date":"2020-06-03T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"Provided is a module which has a package-on-package structure including a redistribution layer and can be easily reduced in height. A module includes an upper module including a substrate, a first component, and a sealing resin layer, and a lower module including an intermediate layer and a redistribution layer. The first component is connected to the redistribution layer with a columnar conductor interposed therebetween and provided in the intermediate layer, and both the first component and a second component are rewired by the redistribution layer. By fixing a resin block containing the second component to a lower surface of the substrate by a fixing conductor, positional deviation of the second component can be prevented. Further, by polishing an upper surface of the resin block, it is possible to improve the flatness."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Module","description":"Provided is a module which has a package-on-package structure including a redistribution layer and can be easily reduced in height. A module includes an upper module including a substrate, a first com","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11264366","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11264366","citation_suggestion":"Patentable. \"Module\" (US-11264366). https://patentable.app/patents/US-11264366","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11264366","json":"https://patentable.app/api/llm-context/US-11264366","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T21:08:16.166Z"}