{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11266046","patent":{"patent_number":"US-11266046","title":"Heatsink for multiple memory modules","assignee":null,"inventors":[],"filing_date":"2020-03-11T00:00:00.000Z","publication_date":"2022-03-01T00:00:00.000Z","cpc_codes":["G06F","H01L","H01L","H01L","G06F"],"num_claims":7,"abstract":"A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heatsink for multiple memory modules","description":"A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surfa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11266046","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11266046","citation_suggestion":"Patentable. \"Heatsink for multiple memory modules\" (US-11266046). https://patentable.app/patents/US-11266046","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11266046","json":"https://patentable.app/api/llm-context/US-11266046","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:27:30.195Z"}