{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11267715","patent":{"patent_number":"US-11267715","title":"Ceria-based composite fine particle dispersion, production method therefor, and polishing abrasive grain dispersion including ceria-based composite fine particle dispersion","assignee":null,"inventors":[],"filing_date":"2018-05-23T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":15,"abstract":"Aiming at providing a ceria-based composite particle dispersion capable of polishing silica film, Si wafer or even hard-to-process material at high polishing rate, and can give high surface accuracy, disclosed is a ceria-based composite particle dispersion that contains a ceria-based composite particle that has an average particle size of 50 to 350 nm, to solve the aforementioned problem, featured by that the ceria-based composite particle has a mother particle, a cerium-containing silica layer, a child particle, and an easily soluble silica-containing layer; the mother particle contains amorphous silica as a major ingredient; the child particle contains crystalline ceria as a major ingredient; ratio of the mass of the easily soluble silica-containing layer relative to the mass of the ceria-based composite particle falls in a specific range; mass ratio of silica and ceria in the ceria-based composite particle falls in a specific range; the ceria-based composite particle, when analyzed by X-ray diffractometry, shows only a crystal phase of ceria; and the ceria-based composite particle has an average crystallite size of the crystalline ceria, when analyzed by X-ray diffractometry, of 10 to 25 nm."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Ceria-based composite fine particle dispersion, production method therefor, and polishing abrasive grain dispersion including ceria-based composite fine particle dispersion","description":"Aiming at providing a ceria-based composite particle dispersion capable of polishing silica film, Si wafer or even hard-to-process material at high polishing rate, and can give high surface accuracy, ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11267715","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11267715","citation_suggestion":"Patentable. \"Ceria-based composite fine particle dispersion, production method therefor, and polishing abrasive grain dispersion including ceria-based composite fine particle dispersion\" (US-11267715). https://patentable.app/patents/US-11267715","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11267715","json":"https://patentable.app/api/llm-context/US-11267715","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T17:21:47.723Z"}