{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11268913","patent":{"patent_number":"US-11268913","title":"Method and apparatus for monitoring edge bevel removal area in semiconductor apparatus and electroplating system","assignee":null,"inventors":[],"filing_date":"2020-05-06T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["G01N","G06T","G06T","H01L","H04N","G06T","G06T","H04N"],"num_claims":20,"abstract":"A method for inspecting a wafer includes: transferring the wafer from a transfer chamber to an annealing station by a robot arm; and monitoring at least one portion of an edge bevel removal area of the wafer over the robot arm when the wafer is transferred from the transfer chamber to the annealing station. The at least one portion of the edge bevel removal area includes a first portion and a second portion different from the first portion. When the wafer is passing through a predetermined location between the transfer chamber and the annealing station, a first charge-coupled device sensor located over the first portion of the edge bevel removal area is used to capture an image of the first portion, and a second charge-coupled device sensor located over the second portion of the edge bevel removal area is used to capture an image of the second portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and apparatus for monitoring edge bevel removal area in semiconductor apparatus and electroplating system","description":"A method for inspecting a wafer includes: transferring the wafer from a transfer chamber to an annealing station by a robot arm; and monitoring at least one portion of an edge bevel removal area of th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11268913","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11268913","citation_suggestion":"Patentable. \"Method and apparatus for monitoring edge bevel removal area in semiconductor apparatus and electroplating system\" (US-11268913). https://patentable.app/patents/US-11268913","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11268913","json":"https://patentable.app/api/llm-context/US-11268913","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:41:31.680Z"}