{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270894","patent":{"patent_number":"US-11270894","title":"Manufacturing method for semiconductor package with cantilever pads","assignee":null,"inventors":[],"filing_date":"2018-01-19T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"One or more embodiments are directed to methods of forming one or more cantilever pads for semiconductor packages. In one embodiment a recess is formed in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method for semiconductor package with cantilever pads","description":"One or more embodiments are directed to methods of forming one or more cantilever pads for semiconductor packages. In one embodiment a recess is formed in a substrate of the package facing the cantile","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270894","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270894","citation_suggestion":"Patentable. \"Manufacturing method for semiconductor package with cantilever pads\" (US-11270894). https://patentable.app/patents/US-11270894","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270894","json":"https://patentable.app/api/llm-context/US-11270894","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:51:10.007Z"}