{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270912","patent":{"patent_number":"US-11270912","title":"Method for forming a via hole self-aligned with a metal block on a substrate","assignee":null,"inventors":[],"filing_date":"2020-12-03T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"Example embodiments relate to methods for forming via holes self-aligned with metal blocks on substrates. One embodiment includes a method where the substrate includes an interlayer dielectric layer. The method includes forming a metallic layer on the interlayer dielectric layer. The method also includes forming a dielectric layer on the metallic layer and forming a plurality of parallel spacer line structures on the dielectric layer. In addition, the method includes forming a sidewall oxide, a first sacrificial layer, and an opening in the first sacrificial layer. Further, the method includes etching the dielectric layer and removing the first sacrificial layer. Additionally, the method includes forming a second sacrificial layer, forming an opening in the second sacrificial layer, depositing a metal block on the metallic layer, and removing the second sacrificial layer. Still further, the method includes etching the metallic layer and the interlayer dielectric layer to form a via hole."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for forming a via hole self-aligned with a metal block on a substrate","description":"Example embodiments relate to methods for forming via holes self-aligned with metal blocks on substrates. One embodiment includes a method where the substrate includes an interlayer dielectric layer. ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270912","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270912","citation_suggestion":"Patentable. \"Method for forming a via hole self-aligned with a metal block on a substrate\" (US-11270912). https://patentable.app/patents/US-11270912","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270912","json":"https://patentable.app/api/llm-context/US-11270912","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:05:21.493Z"}