{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270915","patent":{"patent_number":"US-11270915","title":"Workpiece cutting method and semiconductor chip","assignee":null,"inventors":[],"filing_date":"2018-04-12T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"An object cutting method includes a first step of preparing an object including a single crystal material substrate and a functional device layer provided on a first main surface side, a second step of irradiating the object with laser light to form at least one row of modified regions in the substrate and to form a fracture in the object so as to extend between the at least one row of modified regions and a second main surface of the object, and a third step of performing dry etching on the object from the second main surface side to form a groove opening to the second main surface, in the object. In the third step, the at least one row of modified regions is removed to form an uneven region which has an uneven shape and in which single crystal silicon is exposed, in an inner surface of the groove."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Workpiece cutting method and semiconductor chip","description":"An object cutting method includes a first step of preparing an object including a single crystal material substrate and a functional device layer provided on a first main surface side, a second step o","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270915","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270915","citation_suggestion":"Patentable. \"Workpiece cutting method and semiconductor chip\" (US-11270915). https://patentable.app/patents/US-11270915","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270915","json":"https://patentable.app/api/llm-context/US-11270915","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:05:26.998Z"}