{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270921","patent":{"patent_number":"US-11270921","title":"Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2020-05-08T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes semiconductor dies, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The encapsulant encapsulates the semiconductor dies and is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the semiconductor dies. The high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer. The redistribution structure includes conductive patterns embedded in at least a pair of dielectric layers. The dielectric layers of the pair are made of a third material. The elastic modulus of the first material is higher than the elastic modulus of the third material. The elastic modulus of the second material is higher than the elastic modulus of the third material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof","description":"A semiconductor package includes semiconductor dies, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The encapsulant encapsulates the semiconductor dies and is made of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270921","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270921","citation_suggestion":"Patentable. \"Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof\" (US-11270921). https://patentable.app/patents/US-11270921","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270921","json":"https://patentable.app/api/llm-context/US-11270921","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:36:22.360Z"}