{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270924","patent":{"patent_number":"US-11270924","title":"Heat spreaders for multiple semiconductor device modules","assignee":null,"inventors":[],"filing_date":"2020-05-26T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","G06F","H01L","H01L"],"num_claims":22,"abstract":"A heat spreader for use in a memory system is provided, including a thermally conductive body having a first planar side surface and a second planar side surface opposite the first planar side surface, the first planar side surface configured to attach to a first plurality of co-planar semiconductor devices of a first memory module of the memory system, the second planar side surface configured to attach to a second plurality of co-planar semiconductor devices of a second memory module of the memory system, wherein the first planar side surface and the second planar side surface are separated by a body width w substantially equal to a distance between the first plurality of co-planar semiconductor devices and the second plurality of co-planar semiconductor devices."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat spreaders for multiple semiconductor device modules","description":"A heat spreader for use in a memory system is provided, including a thermally conductive body having a first planar side surface and a second planar side surface opposite the first planar side surface","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270924","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270924","citation_suggestion":"Patentable. \"Heat spreaders for multiple semiconductor device modules\" (US-11270924). https://patentable.app/patents/US-11270924","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270924","json":"https://patentable.app/api/llm-context/US-11270924","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:13:18.490Z"}