{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270934","patent":{"patent_number":"US-11270934","title":"Semiconductor device and method for manufacturing same","assignee":null,"inventors":[],"filing_date":"2019-01-25T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A semiconductor device includes a redistribution layer, a bump bonded to a first surface of the redistribution layer, and a chip bonded to a second surface of the redistribution layer. The redistribution layer includes an insulating layer, a conductive member connecting the bump to the chip and being provided inside the insulating layer, a bonding electrode connected between the conductive member and the bump, and a conductive layer provided between the insulating layer and the conductive member and between the bonding electrode and the conductive member. A resistivity of the conductive member is lower than a resistivity of the conductive layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method for manufacturing same","description":"A semiconductor device includes a redistribution layer, a bump bonded to a first surface of the redistribution layer, and a chip bonded to a second surface of the redistribution layer. The redistribut","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270934","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270934","citation_suggestion":"Patentable. \"Semiconductor device and method for manufacturing same\" (US-11270934). https://patentable.app/patents/US-11270934","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270934","json":"https://patentable.app/api/llm-context/US-11270934","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:45:45.006Z"}