{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270936","patent":{"patent_number":"US-11270936","title":"Integrated circuit including supervia and method of making","assignee":null,"inventors":[],"filing_date":"2019-08-02T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit includes a substrate and a first conductive line extending in a first direction parallel to a top surface of the substrate, wherein the first conductive line is a first distance from the top surface of the substrate. The integrated circuit further includes a second conductive line extending in a second direction parallel to the top surface of the substrate, wherein the second conductive line is a second distance from the top surface of the substrate, and the second distance is greater than the first distance. The integrated circuit further includes a third conductive line extending in the first direction, wherein the second conductive line is a third distance from the top surface of the substrate, and the third distance is greater than the second distance. The integrated circuit further includes a supervia directly connected to the first conductive line and the third conductive line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit including supervia and method of making","description":"An integrated circuit includes a substrate and a first conductive line extending in a first direction parallel to a top surface of the substrate, wherein the first conductive line is a first distance ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270936","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270936","citation_suggestion":"Patentable. \"Integrated circuit including supervia and method of making\" (US-11270936). https://patentable.app/patents/US-11270936","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270936","json":"https://patentable.app/api/llm-context/US-11270936","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T08:26:08.737Z"}