{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270959","patent":{"patent_number":"US-11270959","title":"Enabling magnetic films in inductors integrated into semiconductor packages","assignee":null,"inventors":[],"filing_date":"2018-03-23T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":26,"abstract":"Techniques for fabricating a semiconductor package comprising inductor features and a magnetic film are described. For one technique, fabricating a package includes: forming inductor features comprising a pad and a conductive line on a first build-up layer; forming a raised pad structure on the first build-up layer by fabricating a pillar structure on the pad, wherein a size of the pillar structure is approximately equal or equal to a corresponding size of the pad such that the pillar structure and the pad are aligned or minimally misaligned relative to each other; encapsulating the inductor features and the raised pad structure in a magnetic film; planarizing the magnetic film until top surfaces of the raised pad structure and magnetic film are co-planar; depositing an additional layer on the top surfaces; and forming a via on the raised pad structure by removing portions of the additional layer above the raised pad structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Enabling magnetic films in inductors integrated into semiconductor packages","description":"Techniques for fabricating a semiconductor package comprising inductor features and a magnetic film are described. For one technique, fabricating a package includes: forming inductor features comprisi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270959","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270959","citation_suggestion":"Patentable. \"Enabling magnetic films in inductors integrated into semiconductor packages\" (US-11270959). https://patentable.app/patents/US-11270959","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270959","json":"https://patentable.app/api/llm-context/US-11270959","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:02:11.297Z"}