{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270963","patent":{"patent_number":"US-11270963","title":"Bonding pads including interfacial electromigration barrier layers and methods of making the same","assignee":null,"inventors":[],"filing_date":"2020-01-14T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor die includes a first pad-level dielectric layer embedding first bonding pads and located over a first substrate. Each of the first bonding pads is located within a respective pad cavity in the first pad-level dielectric layer. Each of the first bonding pads includes a first metallic liner containing a first metallic liner material and contacting a sidewall of the respective pad cavity, a first metallic fill material portion embedded in the first metallic liner, and a metallic electromigration barrier layer contacting the first metallic fill material portion and adjoined to the first metallic liner."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bonding pads including interfacial electromigration barrier layers and methods of making the same","description":"A semiconductor die includes a first pad-level dielectric layer embedding first bonding pads and located over a first substrate. Each of the first bonding pads is located within a respective pad cavit","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270963","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270963","citation_suggestion":"Patentable. \"Bonding pads including interfacial electromigration barrier layers and methods of making the same\" (US-11270963). https://patentable.app/patents/US-11270963","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270963","json":"https://patentable.app/api/llm-context/US-11270963","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:20:07.507Z"}