{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11270977","patent":{"patent_number":"US-11270977","title":"Power delivery network for active-on-active stacked integrated circuits","assignee":null,"inventors":[],"filing_date":"2019-11-08T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An apparatus includes a first die including a first substrate with first TSVs running through it, a first top metal layer and first chimney stack vias (CSVs) connecting the first TSVs with the first top metal layer. The apparatus further includes an uppermost die including an uppermost substrate and an uppermost top metal layer, and uppermost CSVs connecting the uppermost substrate with the uppermost top metal layer. The first and uppermost dies are stacked face to face, the first TSVs and the first CSVs are mutually aligned, and the dies are configured such that current is delivered to the apparatus from the first TSVs up through the first CSVs, the first and uppermost top metal layers, and the uppermost CSVs."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power delivery network for active-on-active stacked integrated circuits","description":"An apparatus includes a first die including a first substrate with first TSVs running through it, a first top metal layer and first chimney stack vias (CSVs) connecting the first TSVs with the first t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11270977","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11270977","citation_suggestion":"Patentable. \"Power delivery network for active-on-active stacked integrated circuits\" (US-11270977). https://patentable.app/patents/US-11270977","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11270977","json":"https://patentable.app/api/llm-context/US-11270977","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:06:26.448Z"}