{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11271021","patent":{"patent_number":"US-11271021","title":"Fabrication method of array substrate with greater adhesion between conductive layer and connection member","assignee":null,"inventors":[],"filing_date":"2020-05-12T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":8,"abstract":"An array substrate, a fabrication method thereof, and a display device are provided. The fabrication method includes forming a first conductive layer and a second conductive layer on both of a first area and a second area of a substrate; forming a bonding pin in the first area to electrically connect with a driving chip, wherein the second conductive layer is located at a side of the first conductive layer away from the substrate; and removing the second conductive layer in the second area, forming a conductive electrode in the second area to electrically connect with a light-emitting element by a connection member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fabrication method of array substrate with greater adhesion between conductive layer and connection member","description":"An array substrate, a fabrication method thereof, and a display device are provided. The fabrication method includes forming a first conductive layer and a second conductive layer on both of a first a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11271021","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11271021","citation_suggestion":"Patentable. \"Fabrication method of array substrate with greater adhesion between conductive layer and connection member\" (US-11271021). https://patentable.app/patents/US-11271021","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11271021","json":"https://patentable.app/api/llm-context/US-11271021","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:06:39.533Z"}