{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11272639","patent":{"patent_number":"US-11272639","title":"Heat dissipation panel, heat dissipation apparatus, and electronic device","assignee":null,"inventors":[],"filing_date":"2017-02-07T00:00:00.000Z","publication_date":"2022-03-08T00:00:00.000Z","cpc_codes":["G06F","G06F"],"num_claims":13,"abstract":"A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat dissipation panel, heat dissipation apparatus, and electronic device","description":"A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11272639","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11272639","citation_suggestion":"Patentable. \"Heat dissipation panel, heat dissipation apparatus, and electronic device\" (US-11272639). https://patentable.app/patents/US-11272639","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11272639","json":"https://patentable.app/api/llm-context/US-11272639","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:34:31.490Z"}