{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11275361","patent":{"patent_number":"US-11275361","title":"Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process","assignee":null,"inventors":[],"filing_date":"2017-11-16T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["G05B","G06N","G05B","H01L","G05B","G05B","G05B","G05B","H01L"],"num_claims":20,"abstract":"An initial inspection or critical dimension measurement can be made at various sites on a wafer. The location, design clips, process tool parameters, or other parameters can be used to train a deep learning model. The deep learning model can be validated and these results can be used to retrain the deep learning model. This process can be repeated until the predictions meet a detection accuracy threshold. The deep learning model can be used to predict new probable defect location or critical dimension failure sites."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process","description":"An initial inspection or critical dimension measurement can be made at various sites on a wafer. The location, design clips, process tool parameters, or other parameters can be used to train a deep le","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11275361","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11275361","citation_suggestion":"Patentable. \"Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process\" (US-11275361). https://patentable.app/patents/US-11275361","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11275361","json":"https://patentable.app/api/llm-context/US-11275361","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:34:57.123Z"}