{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11276611","patent":{"patent_number":"US-11276611","title":"Top via on subtractively etched conductive line","assignee":null,"inventors":[],"filing_date":"2020-03-17T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A method for fabricating a semiconductor device including a self-aligned top via includes subtractively etching a conductive layer to form at least a first conductive line on a substrate. After the subtractive etching, the method further includes forming a barrier layer along the substate and along the first conductive line, planarizing at least portions of the barrier layer to obtain at least an exposed first conductive line, recessing at least the exposed first conductive line to form a first recessed conductive line, and forming conductive material in a via opening on the first recessed conductive line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Top via on subtractively etched conductive line","description":"A method for fabricating a semiconductor device including a self-aligned top via includes subtractively etching a conductive layer to form at least a first conductive line on a substrate. After the su","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11276611","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11276611","citation_suggestion":"Patentable. \"Top via on subtractively etched conductive line\" (US-11276611). https://patentable.app/patents/US-11276611","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11276611","json":"https://patentable.app/api/llm-context/US-11276611","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:57:22.865Z"}