{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11276620","patent":{"patent_number":"US-11276620","title":"Package structure and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2019-12-30T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure includes a wiring structure, at least one electronic device, a reinforcement structure, a plurality of conductive vias and an encapsulant. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The electronic device is electrically connected to the wiring structure. The reinforcement structure is disposed on a surface of the wiring structure, and includes a thermoset material. The conductive vias is disposed in the reinforcement structure. The encapsulant covers the electronic device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and method for manufacturing the same","description":"A package structure includes a wiring structure, at least one electronic device, a reinforcement structure, a plurality of conductive vias and an encapsulant. The wiring structure includes at least on","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11276620","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11276620","citation_suggestion":"Patentable. \"Package structure and method for manufacturing the same\" (US-11276620). https://patentable.app/patents/US-11276620","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11276620","json":"https://patentable.app/api/llm-context/US-11276620","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:20:34.169Z"}