{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11276633","patent":{"patent_number":"US-11276633","title":"Semiconductor package having UBM pad with gap separating central portion from peripheral portion","assignee":null,"inventors":[],"filing_date":"2020-06-18T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes; a semiconductor chip, a conductive pattern electrically connected to the semiconductor chip, a pad electrically connected to the conductive pattern, and a connection member disposed on and electrically connected to the pad. The pad includes a central portion and a peripheral portion at least partially surrounding the central portion and separated from the peripheral portion by a gap, and the connection member contacts at least one of a side surface of the central portion and an inner side surface of the peripheral portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package having UBM pad with gap separating central portion from peripheral portion","description":"A semiconductor package includes; a semiconductor chip, a conductive pattern electrically connected to the semiconductor chip, a pad electrically connected to the conductive pattern, and a connection ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11276633","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11276633","citation_suggestion":"Patentable. \"Semiconductor package having UBM pad with gap separating central portion from peripheral portion\" (US-11276633). https://patentable.app/patents/US-11276633","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11276633","json":"https://patentable.app/api/llm-context/US-11276633","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:10:16.312Z"}