{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11276634","patent":{"patent_number":"US-11276634","title":"High density package substrate formed with dielectric bi-layer","assignee":null,"inventors":[],"filing_date":"2017-05-23T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Disclosed herein are integrated circuit (IC) package substrates formed with a dielectric bi-layer, and related devices and methods. In some embodiments, an IC package substrate is fabricated by: forming a raised feature on a conductive layer; forming a dielectric bi-layer on the conductive layer, where the dielectric bi-layer includes a first sub-layer having a first material property and a second sub-layer having a second material property, and where the top surface of the second sub-layer is substantially planar with the top surface of the raised feature; and removing the first sub-layer until the second material property is detected to reveal the conductive feature. In some embodiments, an IC package substrate is fabricated by: forming a dielectric bi-layer on a patterned conductive layer, where the first sub-layer is less susceptible to removal than the second sub-layer; forming an opening in the dielectric bi-layer; etching; and forming a via having vertical sidewalls."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"High density package substrate formed with dielectric bi-layer","description":"Disclosed herein are integrated circuit (IC) package substrates formed with a dielectric bi-layer, and related devices and methods. In some embodiments, an IC package substrate is fabricated by: formi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11276634","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11276634","citation_suggestion":"Patentable. \"High density package substrate formed with dielectric bi-layer\" (US-11276634). https://patentable.app/patents/US-11276634","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11276634","json":"https://patentable.app/api/llm-context/US-11276634","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T17:25:29.001Z"}