{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11276636","patent":{"patent_number":"US-11276636","title":"Adjustable via dimension and chamfer angle","assignee":null,"inventors":[],"filing_date":"2019-07-31T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Chamfer-less via interconnects and techniques for fabrication thereof with a protective dielectric arch are provided. In one aspect, a method of forming an interconnect includes: forming metal lines in a first dielectric; depositing an etch stop liner onto the first dielectric; depositing a second dielectric on the etch stop liner; patterning vias and a trench in the second dielectric, wherein the vias are present over at least one of the metal lines, and wherein the patterning forms patterned portions of the second dielectric/etch stop liner over at least another one of the metal lines; forming a protective dielectric arch over the at least another one of the metal lines; and filling the vias/trench with a metal(s) to form the interconnect which, due to the protective dielectric arch, is in a non-contact position with the at least another one of the metal lines. An interconnect structure is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Adjustable via dimension and chamfer angle","description":"Chamfer-less via interconnects and techniques for fabrication thereof with a protective dielectric arch are provided. In one aspect, a method of forming an interconnect includes: forming metal lines i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11276636","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11276636","citation_suggestion":"Patentable. \"Adjustable via dimension and chamfer angle\" (US-11276636). https://patentable.app/patents/US-11276636","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11276636","json":"https://patentable.app/api/llm-context/US-11276636","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:30:55.074Z"}