{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11276645","patent":{"patent_number":"US-11276645","title":"Encapsulation of a substrate electrically connected to a plurality of pin arrays","assignee":null,"inventors":[],"filing_date":"2020-08-19T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A chip and a packaging method thereof. In the chip, first solder pads in a first solder pad array on a first substrate are attached to corresponding second pins in second pin arrays on different dies to implement short-distance and high-density interconnection of the different dies. A molding body is used to wrap a first pin, a second pin, a first solder pad, and the first substrate, so that a fan-out unit and the first substrate are molded into an integral structure. In the integral structure, bottoms of first pins that are in a first pin array on a die and that are electrically connected to a periphery of the chip are not wrapped by the molding body."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Encapsulation of a substrate electrically connected to a plurality of pin arrays","description":"A chip and a packaging method thereof. In the chip, first solder pads in a first solder pad array on a first substrate are attached to corresponding second pins in second pin arrays on different dies ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11276645","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11276645","citation_suggestion":"Patentable. \"Encapsulation of a substrate electrically connected to a plurality of pin arrays\" (US-11276645). https://patentable.app/patents/US-11276645","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11276645","json":"https://patentable.app/api/llm-context/US-11276645","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:35:26.620Z"}