{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11276655","patent":{"patent_number":"US-11276655","title":"Ground reference shape for high speed interconnect","assignee":null,"inventors":[],"filing_date":"2020-05-22T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Apparatus and methods are provided for providing provide high-speed interconnect using bond wires. According to various aspects of the subject innovation, the provided techniques may provide a ground shape to shield a high-speed signal wire from the substrate in a semiconductor assembly. In an exemplary embodiment, there is provided an assembly that may comprise a substrate, a semiconductor die attached to the substrate, a signal bond wire connecting a bond pad on the semiconductor die and a bond finger on the substrate, and a ground shape on the substrate to shield the signal wire from the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Ground reference shape for high speed interconnect","description":"Apparatus and methods are provided for providing provide high-speed interconnect using bond wires. According to various aspects of the subject innovation, the provided techniques may provide a ground ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11276655","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11276655","citation_suggestion":"Patentable. \"Ground reference shape for high speed interconnect\" (US-11276655). https://patentable.app/patents/US-11276655","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11276655","json":"https://patentable.app/api/llm-context/US-11276655","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:33:26.575Z"}