{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11276660","patent":{"patent_number":"US-11276660","title":"Semiconductor device package having a core substrate and an embedded component in the core substrate","assignee":null,"inventors":[],"filing_date":"2019-11-27T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor device package includes an electronic component, a first passivation layer having an inner surface surrounding the electronic component, and a conductive layer disposed on the inner surface of the first passivation layer. The electronic component has a first surface, a second surface opposite the first surface, and a lateral surface extended between the first surface and the second surface. The conductive layer has a relatively rough surface. A method of manufacturing a semiconductor device package is also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package having a core substrate and an embedded component in the core substrate","description":"A semiconductor device package includes an electronic component, a first passivation layer having an inner surface surrounding the electronic component, and a conductive layer disposed on the inner su","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11276660","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11276660","citation_suggestion":"Patentable. \"Semiconductor device package having a core substrate and an embedded component in the core substrate\" (US-11276660). https://patentable.app/patents/US-11276660","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11276660","json":"https://patentable.app/api/llm-context/US-11276660","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:47:25.224Z"}