{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11277917","patent":{"patent_number":"US-11277917","title":"Embedded component package structure, embedded type panel substrate and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2019-03-12T00:00:00.000Z","publication_date":"2022-03-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An embedded component package structure including a circuit substrate, an embedded component and a stress compensation layer is provided. The circuit substrate includes a core layer and an asymmetric circuit structure, and the core layer has a first thickness. The embedded component is disposed in the core layer. The stress compensation layer is disposed on one side of the core layer, and the stress compensation layer has a second thickness between 4 μm and 351 μm."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Embedded component package structure, embedded type panel substrate and manufacturing method thereof","description":"An embedded component package structure including a circuit substrate, an embedded component and a stress compensation layer is provided. The circuit substrate includes a core layer and an asymmetric ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11277917","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11277917","citation_suggestion":"Patentable. \"Embedded component package structure, embedded type panel substrate and manufacturing method thereof\" (US-11277917). https://patentable.app/patents/US-11277917","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11277917","json":"https://patentable.app/api/llm-context/US-11277917","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:13:48.691Z"}