{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282717","patent":{"patent_number":"US-11282717","title":"Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap","assignee":null,"inventors":[],"filing_date":"2018-03-30T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. The substrate protrusion can enable void-free underfill."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap","description":"A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282717","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282717","citation_suggestion":"Patentable. \"Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap\" (US-11282717). https://patentable.app/patents/US-11282717","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282717","json":"https://patentable.app/api/llm-context/US-11282717","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:59:17.731Z"}