{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282744","patent":{"patent_number":"US-11282744","title":"Enhanced intermetal dielectric adhesion","assignee":null,"inventors":[],"filing_date":"2019-09-30T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Device and method of forming the device are disclosed. A semiconductor device includes a back-end-of-line dielectric (BEOL) with a plurality of IMD levels over a substrate processed with front-end-of-line components. The BEOL includes an upper IMD level and upper metal lines, with a buffer layer over the upper metal lines. The buffer layer improves adhesion of the upper IMD layer which covers the upper metal lines. Improving the adhesion of the upper IMD layer improves the reliability of the device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Enhanced intermetal dielectric adhesion","description":"Device and method of forming the device are disclosed. A semiconductor device includes a back-end-of-line dielectric (BEOL) with a plurality of IMD levels over a substrate processed with front-end-of-","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282744","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282744","citation_suggestion":"Patentable. \"Enhanced intermetal dielectric adhesion\" (US-11282744). https://patentable.app/patents/US-11282744","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282744","json":"https://patentable.app/api/llm-context/US-11282744","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:48:21.630Z"}