{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282759","patent":{"patent_number":"US-11282759","title":"Chip package structure having warpage control and method of forming the same","assignee":null,"inventors":[],"filing_date":"2020-03-12T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure and a method of forming the same are provided. The package structure includes a package substrate, an interposer substrate, a first semiconductor device, a second semiconductor device, and a protective layer. The interposer substrate is disposed over the package substrate. The first semiconductor device and the second semiconductor device are disposed over the interposer substrate, wherein the first semiconductor device and the second semiconductor device are different types of electronic devices. The protective layer is formed over the interposer substrate to surround the first semiconductor device and the second semiconductor device. The second semiconductor device is exposed from the protective layer and the first semiconductor device is not exposed from the protective layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package structure having warpage control and method of forming the same","description":"A package structure and a method of forming the same are provided. The package structure includes a package substrate, an interposer substrate, a first semiconductor device, a second semiconductor dev","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282759","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282759","citation_suggestion":"Patentable. \"Chip package structure having warpage control and method of forming the same\" (US-11282759). https://patentable.app/patents/US-11282759","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282759","json":"https://patentable.app/api/llm-context/US-11282759","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:28:27.010Z"}