{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282761","patent":{"patent_number":"US-11282761","title":"Semiconductor packages and methods of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2019-10-17T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Semiconductor packages and methods of forming the same are disclosed. One of the semiconductor packages includes a first redistribution layer structure, a package structure, a bus die and a plurality of connectors. The package structure is disposed over the first redistribution layer structure, and includes a plurality of package components. The bus die and the connectors are encapsulated by a first encapsulant between the package structure and the first redistribution layer structure. The bus die is electrically connected to two or more of the plurality of package components, and the package structure are electrically connected to the first redistribution layer structure through the plurality of connectors."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages and methods of manufacturing the same","description":"Semiconductor packages and methods of forming the same are disclosed. One of the semiconductor packages includes a first redistribution layer structure, a package structure, a bus die and a plurality ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282761","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282761","citation_suggestion":"Patentable. \"Semiconductor packages and methods of manufacturing the same\" (US-11282761). https://patentable.app/patents/US-11282761","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282761","json":"https://patentable.app/api/llm-context/US-11282761","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:40:25.228Z"}