{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282762","patent":{"patent_number":"US-11282762","title":"Heat sink design for flip chip ball grid array","assignee":null,"inventors":[],"filing_date":"2020-02-07T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"A flip chip ball grid array (FCBGA) comprises a substrate, a cavity forming ring stiffener, an external heat sink, and a thermal interface material. The cavity forming ring stiffener is disposed on the substrate. The cavity forming ring stiffener has a segment which forms a cavity with the substrate, and exposes a top of the silicon chip. The external heat sink is disposed on the silicon chip and the segment of the cavity forming ring stiffener. A thermal interface material separates the segment of the cavity forming ring stiffener and the top of the silicon chip from the external heat sink and conducts heat from the silicon chip to the external heat sink."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat sink design for flip chip ball grid array","description":"A flip chip ball grid array (FCBGA) comprises a substrate, a cavity forming ring stiffener, an external heat sink, and a thermal interface material. The cavity forming ring stiffener is disposed on th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282762","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282762","citation_suggestion":"Patentable. \"Heat sink design for flip chip ball grid array\" (US-11282762). https://patentable.app/patents/US-11282762","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282762","json":"https://patentable.app/api/llm-context/US-11282762","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:59:23.658Z"}