{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282773","patent":{"patent_number":"US-11282773","title":"Enlarged conductive pad structures for enhanced chip bond assembly yield","assignee":null,"inventors":[],"filing_date":"2020-04-10T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Enlarged conductive pad structures for enhanced chip bond assembly yield","description":"An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282773","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282773","citation_suggestion":"Patentable. \"Enlarged conductive pad structures for enhanced chip bond assembly yield\" (US-11282773). https://patentable.app/patents/US-11282773","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282773","json":"https://patentable.app/api/llm-context/US-11282773","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T12:00:37.002Z"}