{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282774","patent":{"patent_number":"US-11282774","title":"Power semiconductor module arrangement","assignee":null,"inventors":[],"filing_date":"2020-05-05T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A power semiconductor module arrangement includes a semiconductor substrate arranged in a housing, and a mounting arrangement including a frame or body, and at least one terminal element coupled to the frame or body. The mounting arrangement is inserted in and coupled to the housing. The mounting arrangement has a lower surface which, when the mounting arrangement is inserted in and coupled to the housing, rests on at least one contact surface of the housing. When the mounting arrangement is inserted in and coupled to the housing, the at least one terminal element mechanically and electrically contacts the semiconductor substrate with a first end, and a distance between an upper surface of the semiconductor substrate and the at least one contact surface in a vertical direction equals a length of the first end between the upper surface of the semiconductor substrate and the lower surface of the mounting arrangement."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power semiconductor module arrangement","description":"A power semiconductor module arrangement includes a semiconductor substrate arranged in a housing, and a mounting arrangement including a frame or body, and at least one terminal element coupled to th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282774","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282774","citation_suggestion":"Patentable. \"Power semiconductor module arrangement\" (US-11282774). https://patentable.app/patents/US-11282774","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282774","json":"https://patentable.app/api/llm-context/US-11282774","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:34:15.993Z"}