{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282777","patent":{"patent_number":"US-11282777","title":"Semiconductor package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2019-12-31T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":23,"abstract":"A semiconductor package includes a core layer, a conductive interconnect and a semiconductor chip. The core layer has a top surface and a bottom surface opposite to the top surface. The conductive interconnect penetrates through the core layer. The conductive interconnect has a top surface and a bottom surface respectively exposed from the top surface and the bottom surface of the core layer. The semiconductor chip is disposed on the top surface of the core layer. The semiconductor chip includes a conductive pad, and the top surface of the conductive interconnect directly contacts the conductive pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and method of manufacturing the same","description":"A semiconductor package includes a core layer, a conductive interconnect and a semiconductor chip. The core layer has a top surface and a bottom surface opposite to the top surface. The conductive int","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282777","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282777","citation_suggestion":"Patentable. \"Semiconductor package and method of manufacturing the same\" (US-11282777). https://patentable.app/patents/US-11282777","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282777","json":"https://patentable.app/api/llm-context/US-11282777","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:35:58.140Z"}