{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282778","patent":{"patent_number":"US-11282778","title":"Interposer between a conductive substrate and plurality of semiconductor components","assignee":null,"inventors":[],"filing_date":"2019-12-04T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"A semiconductor device package includes a redistribution structure, a conductive substrate stacked on the redistribution structure and an encapsulant encapsulating the redistribution structure and the conductive substrate. The encapsulant encapsulates a side surface of the conductive substrate. A method for manufacturing an electronic device package includes: providing a carrier, forming a redistribution structure on the carrier, mounting a conductive substrate on a first surface of the redistribution structure, forming a first encapsulant to encapsulate the first surface of the redistribution structure and a side surface of the conductive substrate, and removing the carrier."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interposer between a conductive substrate and plurality of semiconductor components","description":"A semiconductor device package includes a redistribution structure, a conductive substrate stacked on the redistribution structure and an encapsulant encapsulating the redistribution structure and the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282778","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282778","citation_suggestion":"Patentable. \"Interposer between a conductive substrate and plurality of semiconductor components\" (US-11282778). https://patentable.app/patents/US-11282778","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282778","json":"https://patentable.app/api/llm-context/US-11282778","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:00:52.280Z"}