{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282779","patent":{"patent_number":"US-11282779","title":"Package structure and fabricating method thereof","assignee":null,"inventors":[],"filing_date":"2020-02-20T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure including a first circuit board structure, a redistribution layer structure, bonding elements, and a semiconductor package is provided. The redistribution layer structure is disposed over and electrically connected to the first circuit board structure. The bonding elements are disposed between and electrically connected to the redistribution layer structure and the first circuit board structure. Each of the bonding elements has a core portion and a shell portion surrounding the core portion. A stiffness of the core portion is higher than a stiffness of the shell portion. A semiconductor package is disposed over and electrically connected to the redistribution layer structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and fabricating method thereof","description":"A package structure including a first circuit board structure, a redistribution layer structure, bonding elements, and a semiconductor package is provided. The redistribution layer structure is dispos","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282779","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282779","citation_suggestion":"Patentable. \"Package structure and fabricating method thereof\" (US-11282779). https://patentable.app/patents/US-11282779","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282779","json":"https://patentable.app/api/llm-context/US-11282779","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:52:11.730Z"}