{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282790","patent":{"patent_number":"US-11282790","title":"Semiconductor device with composite landing pad for metal plug","assignee":null,"inventors":[],"filing_date":"2020-09-09T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"The present disclosure relates to a semiconductor device with a composite landing pad. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate. The semiconductor device also includes a lower metal plug and a barrier layer disposed in the first dielectric layer. The lower metal plug is surrounded by the barrier layer. The semiconductor device further includes an inner silicide portion disposed over the lower metal plug, and an outer silicide portion disposed over the barrier layer. A topmost surface of the outer silicide portion is higher than a topmost surface of the inner silicide portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with composite landing pad for metal plug","description":"The present disclosure relates to a semiconductor device with a composite landing pad. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate. The semicondu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282790","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282790","citation_suggestion":"Patentable. \"Semiconductor device with composite landing pad for metal plug\" (US-11282790). https://patentable.app/patents/US-11282790","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282790","json":"https://patentable.app/api/llm-context/US-11282790","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:38:52.304Z"}