{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282795","patent":{"patent_number":"US-11282795","title":"Semiconductor package with barrier layer","assignee":null,"inventors":[],"filing_date":"2020-07-15T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A packaged integrated circuit device includes a frame having a cavity therein and an inner semiconductor chip within the cavity. A lower re-distribution layer is provided, which extends adjacent lower surfaces of the frame and the inner semiconductor chip. The lower re-distribution layer has an opening therein which at least partially exposes the lower surface of the inner semiconductor chip. A lower semiconductor chip is provided, which extends adjacent the lower surface of the inner semiconductor chip, and within the opening in the lower re-distribution layer. This lower re-distribution layer includes: (i) an insulating layer covering the lower surface of the frame, (ii) a re-distribution pattern disposed on the insulating layer, and (iii) a barrier layer, which is disposed on the insulating layer and surrounds at least a portion of the lower semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with barrier layer","description":"A packaged integrated circuit device includes a frame having a cavity therein and an inner semiconductor chip within the cavity. A lower re-distribution layer is provided, which extends adjacent lower","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282795","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282795","citation_suggestion":"Patentable. \"Semiconductor package with barrier layer\" (US-11282795). https://patentable.app/patents/US-11282795","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282795","json":"https://patentable.app/api/llm-context/US-11282795","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:52:04.614Z"}