{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11282797","patent":{"patent_number":"US-11282797","title":"Manufacturing method of high frequency module and high frequency module having groove in sealing resin layer","assignee":null,"inventors":[],"filing_date":"2020-10-29T00:00:00.000Z","publication_date":"2022-03-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A high frequency module having a groove for shielding formed in a sealing resin layer achieves downsizing without damaging wiring electrodes formed on a wiring board or mounting components. A manufacturing method of a high frequency module includes mounting components on an upper surface of a wiring board, and then forming a sacrificial layer for forming a groove. The method further includes forming a sealing resin layer for sealing the components and the sacrificial layer, and dissolving and removing the sacrificial layer to form the groove for shielding. Finally, the method includes forming a shield film coating the surface of the sealing resin layer, and the high frequency module is manufactured. With this method, even when the groove is formed at a position overlapping with the component or a surface layer wiring electrode, the high frequency module can be downsized without damaging the component or the surface layer wiring electrode."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method of high frequency module and high frequency module having groove in sealing resin layer","description":"A high frequency module having a groove for shielding formed in a sealing resin layer achieves downsizing without damaging wiring electrodes formed on a wiring board or mounting components. A manufact","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11282797","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11282797","citation_suggestion":"Patentable. \"Manufacturing method of high frequency module and high frequency module having groove in sealing resin layer\" (US-11282797). https://patentable.app/patents/US-11282797","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11282797","json":"https://patentable.app/api/llm-context/US-11282797","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:15:55.842Z"}